Researchers have developed a groundbreaking flexible ferroelectric memory device based on the lead-free material BiFeO3 (BFO). This innovative device, fabricated on a flexible mica substrate using a SrTiO3 (STO) buffer layer, exhibits exceptional performance and stability, making it a promising candidate for next-generation wearable electronics. The device’s remarkable properties, including high remnant polarization, superior fatigue resistance, and mechanical flexibility, pave the way for the integration of advanced ferroelectric memory into flexible and stretchable platforms, transforming the future of smart wearables.
Unlocking the Potential of Flexible Electronics
The rapid advancements in technology’>wearable technology, robotics. By seamlessly integrating high-performance memory into flexible and stretchable platforms, these technologies can unlock new frontiers in human-machine interactions, personal health monitoring, and smart environments, ultimately enhancing the way we live, work, and interact with the world around us.

Author credit: This article is based on research by Xingpeng Liu, Yiming Peng, Fabi Zhang, Tangyou Sun, Ying Peng, Lei Wen, Haiou Li.
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